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Multiplan-50 FI Levelling Compound

Availability: 193 in stock (Also available to pre-order, see FAQ for details)

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MULTIPLAN-50 FI Levelling Compound

Fibre reinforced rapid setting cement based self levelling compound

� Fibre reinforced, suitable on plywood overlay
� Suitable on underfloor heating
� Fast curing, foot traffic after 2-3 hours*
� Flexible, polymer modified
� Low emission
� Easy to process, can be pump applied
� For layers 1-50 mm thick
� For interior application only

NEW FORMULA, MORE FLUID, LONG LASTING

* Data references taken on floating screeds with thickness ? 5 cm at 23�C an 50% of relative humidity

MULTIPLAN-50 FI is used for smoothening and levelling in layers of 1-50 mm thick. Suitable substrates are concrete floors in accordance with DIN 1045, heated and unheated cementbased screeds in accordance with DIN 18560, old, well bonded tile finishes and rapid cement-based screeds. MULTIPLAN-50 FI is also suitable for use on plywood overlay, on chipboard and on old wooden floorboards as well.

� On timber floor boards;
� On old substrates with bonded adhesive and levelling compound residues;
� For the restoration and repair of wooden floors and additionally for screeds and substrates in old and new construction;
� For producing flat, absorbent, high strength installation surfaces for textile and elastic floor finishes as well as for ceramic tiles;
� Suitable for use on heated substrates.

For Technical Data Sheet please – click here.

For Declaration of Performance please – click here.

Weight20 kg
Dimensions50 × 30 × 20 cm
HS Code

3824509000

SKUbenfer-multiplan-50_FI
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